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Micro-FCPGA
The micro-FCPGA (Flip Chip Plastic Grid Array) package consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. The package uses 478 pins, which are 2.03 mm long and .32 mm in diameter. While there are several micro-FCPGA socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the processor. Different from micro-PGA, the micro-FCPGA does not have an interposer and it includes capacitors on the bottom side.
S.E.C.C. Package Type
S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon™ and Pentium III Xeon processors, which have 330 contacts.
PPGA Package Type
PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.
PGA Package Type
PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins.
FC-PGA2 Package Type
FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).
OOI Package Type
OOI is short for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate face-down for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins.
FC-PGA Package Type
The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.
NLX Motherboard
NLX (New Low Profile Extended) was a form factor proposed by Intel and developed jointly with IBM, DEC, and other vendors for low profile, low cost, mass-marketed retail PCs. Release 1.2 was finalized in March 1997 and release 1.8 was finalized in April 1999. NLX was similar in overall design to LPX, including a riser card and a low-profile slimline case. It was modernized and updated to allow support for the latest technologies while keeping costs down and fixing the main problems with LPX.
LTX Motherboard
LPX (Low Profile eXtension), originally developed by Western Digital, was a loosely defined motherboard format (form factor) widely used in the 1990s.
ATX motherboard
The ATX (for Advanced Technology Extended) form factor was created by Intel in 1995. It was the first big change in computer case and motherboard design in many years. ATX overtook AT completely as the default form factor for new systems. ATX addressed many of the AT form factor's annoyances that had frustrated system builders. Other standards for smaller boards (including microATX, FlexATX and mini-ITX) usually keep the basic rear layout but reduce the size of the board and the number of expansion slot positions. In 2003, Intel announced the new BTX standard, intended as a replacement for ATX. As of January 2007 the ATX form factor remains the industry standard for do-it-yourselfers; BTX has however made inroads into pre-made systems, being adopted by computer makers like Dell, Gateway, and HP.
AT Motherboard
Advance Technology Motherboard. The motherboard that originally came with the IBM PC/AT computers, or one following the same design.
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